Thermoplastic resin composition having high rigidity and low coefficient of linear thermal expansion and molded article comprising same

The present disclosure provides a thermoplastic resin composition having high rigidity and a low coefficient of linear thermal expansion and a molded article including the same. Specifically, the thermoplastic resin composition includes a polypropylene composite resin including high-crystalline poly...

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Bibliographische Detailangaben
Hauptverfasser: Park, Chun Ho, Yoon, Jin Young, Lee, Hee Joon, Cha, Dong Eun, Jeong, Seung Ryong, Chae, Jin Bo, Kwon, Sun Jun
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The present disclosure provides a thermoplastic resin composition having high rigidity and a low coefficient of linear thermal expansion and a molded article including the same. Specifically, the thermoplastic resin composition includes a polypropylene composite resin including high-crystalline polypropylene and the like, an elastomer, and an inorganic filler.