Thermoplastic resin composition having high rigidity and low coefficient of linear thermal expansion and molded article comprising same
The present disclosure provides a thermoplastic resin composition having high rigidity and a low coefficient of linear thermal expansion and a molded article including the same. Specifically, the thermoplastic resin composition includes a polypropylene composite resin including high-crystalline poly...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | The present disclosure provides a thermoplastic resin composition having high rigidity and a low coefficient of linear thermal expansion and a molded article including the same. Specifically, the thermoplastic resin composition includes a polypropylene composite resin including high-crystalline polypropylene and the like, an elastomer, and an inorganic filler. |
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