Methods and apparatus for warpage correction

Methods and apparatus for processing a substrate are provided herein. For example, a system for processing a substrate includes a process chamber comprising a first processing volume and a second processing volume, a carrier disposed in the first processing volume, comprising a first thermoelectric...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Thirunavukarasu, Sriskantharajah, Tan, Puay Han, Parathithasan, Karrthik, Tan, Chin Wei, Teo, Wei Jie Dickson, Su, Jun-Liang, Lim, Fang Jie
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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