Semiconductor components having conductive vias with aligned back side conductors

A semiconductor component includes a semiconductor substrate, conductive vias in the substrate having terminal portions, a polymer layer on the substrate and back side conductors formed by the terminal portions of the conductive vias embedded in the polymer layer. A stacked semiconductor component i...

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Bibliographische Detailangaben
Hauptverfasser: Li, Jin, Jiang, Tongbi
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A semiconductor component includes a semiconductor substrate, conductive vias in the substrate having terminal portions, a polymer layer on the substrate and back side conductors formed by the terminal portions of the conductive vias embedded in the polymer layer. A stacked semiconductor component includes a plurality of components having aligned conductive vias in electrical communication with one another.