Apparatus and system for treating substrate

An apparatus and system for treating a substrate includes a chamber having an inner space, a support unit in the inner space and configured to support and rotate the substrate, and first and second laser irradiation unit configured to irradiate first and second laser beams onto the substrate. The fi...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	Kwon, Ohyeol, Lee, Jung Hwan, Park, Soo Young, Ahn, Jun Keon, Yang, Seungtae
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CLEANING CLEANING IN GENERAL CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PREVENTION OF FOULING IN GENERAL SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	An apparatus and system for treating a substrate includes a chamber having an inner space, a support unit in the inner space and configured to support and rotate the substrate, and first and second laser irradiation unit configured to irradiate first and second laser beams onto the substrate. The first laser irradiation unit includes a first laser light source configured to generate the first laser beam, and a first wavelength adjusting member configured to adjust a range of a wavelength of the first laser beam received from the first laser light source. The second laser beam, and a second wavelength adjusting member configured to adjust a range of a wavelength of the second laser beam received from the second laser light source.