Electroplating apparatus and electroplating method

An electroplating apparatus includes an anode and a cathode, a power supply, a regulating plate, and a controller. The power supply is electrically connected to the anode and the cathode. The regulating plate is disposed between the anode and the cathode. The regulating plate includes an insulation...

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Bibliographische Detailangaben
Hauptverfasser:	Chan, Chih-Kai, Cheng, Shih-Lian, Nien, Heng-Ming, Lu, Chih-Chiang
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	An electroplating apparatus includes an anode and a cathode, a power supply, a regulating plate, and a controller. The power supply is electrically connected to the anode and the cathode. The regulating plate is disposed between the anode and the cathode. The regulating plate includes an insulation grid plate and a plurality of wires. The controller is electrically connected to the plurality of wires to control a state of an electromagnetic field around the plurality of wires. An electroplating method is also provided.