Metal surface protection

Techniques regarding methods and/or apparatuses for protecting metal substrates during one or more lithography processes are provided. For example, one or more embodiments described herein can comprise a method that can include coating a metal substrate with a polymer film that self-assembles on a m...

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Bibliographische Detailangaben
Hauptverfasser: Afzali-Ardakani, Ali, Rath, David L, Totir, George Gabriel, Bangsaruntip, Sarunya
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Techniques regarding methods and/or apparatuses for protecting metal substrates during one or more lithography processes are provided. For example, one or more embodiments described herein can comprise a method that can include coating a metal substrate with a polymer film that self-assembles on a metal oxide positioned on a surface of the metal substrate. The method can also include covalently bonding the polymer film to the metal oxide.