Enhanced hybrid systems and methods for characterizing stress in chemically strengthened transparent substrates

Enhanced hybrid systems and methods for characterizing stress in chemically strengthened transparent substrates

The hybrid measurement system includes an evanescent prism coupling spectroscopy (EPCS) sub-system and a light-scattering polarimetry (LSP) sub-system. The EPCS sub-system includes an EPCS light source system optically coupled to an EPCS detector system through an EPCS coupling prism. The LSP sub-sy...

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Bibliographische Detailangaben
Hauptverfasser: Bouzi, Pierre Michel, Jacobson, Jeremiah Robert, Newcomer, Glenn Abram, Stepanov, Viktor, Wetmore, Nathaniel David, Immerman, Jacob, Andrews, Ryan Claude, Lindberg, Katherine Anne, Berg, David Matthew, Furnas, William John, Olson, Evan Lewis
Format: Patent
Sprache:eng
Schlagworte:
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
TESTING
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Zusammenfassung:The hybrid measurement system includes an evanescent prism coupling spectroscopy (EPCS) sub-system and a light-scattering polarimetry (LSP) sub-system. The EPCS sub-system includes an EPCS light source system optically coupled to an EPCS detector system through an EPCS coupling prism. The LSP sub-system includes an LSP light source optically coupled to an optical compensator, which in turn is optically coupled to a LSP detector system via a LSP coupling prism. A support structure supports the EPCS and LSP coupling prisms to define a coupling prism assembly, which supports the two prisms at a measurement location. Stress measurements made using the EPCS and LSP sub-systems are combined to fully characterize the stress properties of a transparent chemically strengthened substrate. Methods of processing the EPCS and LSP measurements and enhanced configurations of the EPCS and LPS sub-systems to improve measurement accuracy are also disclosed.