Moisture curable polyurethane hot melt adhesive composition having low levels of diisocyanate monomer

A moisture curable polyurethane hot melt adhesive composition and a process for making the same are disclosed. The moisture curable polyurethane hot melt adhesive composition includes an isocyanate-terminated polyurethane prepolymer that is the reaction product of a diisocyanate monomer component th...

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Bibliographische Detailangaben
Hauptverfasser:	Das, Sudipto, Van Dyke, Daniel J, Gurr, Matthias E, Paul, Rituparna, Carlson, Brian W
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	A moisture curable polyurethane hot melt adhesive composition and a process for making the same are disclosed. The moisture curable polyurethane hot melt adhesive composition includes an isocyanate-terminated polyurethane prepolymer that is the reaction product of a diisocyanate monomer component that includes at least 20% by weight asymmetrical diisocyanate monomer based on the weight of the diisocyanate monomer component and symmetrical diisocyanate monomer, at least one polyol having a number average molecular weight greater than 1000 g/mole, a monofunctional compound that includes one isocyanate-reactive group and has a molecular weight no greater than 400 g/mole, and a multifunctional compound that includes at least two isocyanate-reactive groups and has a molecular weight no greater than 400 g/mole.