Heatsink installation

An information handling system includes a heatsink interface component, a printed circuit board assembly, and an upstream heatsink. The heatsink interface component aligns the upstream heatsink on the printed circuit board assembly. The heatsink interface component includes first, second, third, and...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	Chien, Tung-Yu
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	An information handling system includes a heatsink interface component, a printed circuit board assembly, and an upstream heatsink. The heatsink interface component aligns the upstream heatsink on the printed circuit board assembly. The heatsink interface component includes first, second, third, and fourth sides. The heatsink interface component also includes multiple posts. Each of a first set of the posts is located on a top surface of the second side, and each of a second set of the posts is located on a top surface of the fourth side. The heatsink interface component also includes recesses located within the second and fourth sides. Each of a first set of the recesses extends from a bottom surface to the top surface of the second side, and each of a second set of the recesses extends from a bottom surface to the top surface of the fourth side.