Semiconductor module

A semiconductor module, including a cooler having first and second flow passages respectively formed on first and second sides of the semiconductor module that are opposite to each other, and a third flow passage connecting the first and second flow passages. The semiconductor module further include...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	Sato, Yushi
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES MEASURING QUANTITY OF HEAT MEASURING TEMPERATURE PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TESTING THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
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Beschreibung
Zusammenfassung:	A semiconductor module, including a cooler having first and second flow passages respectively formed on first and second sides of the semiconductor module that are opposite to each other, and a third flow passage connecting the first and second flow passages. The semiconductor module further includes a laminated substrate disposed on the cooler and having first to third circuit boards, a first sensing chip having a sensing function for detecting a temperature and a first non-sensing chip not having the sensing function, disposed on the first circuit board side by side along the third flow passage, and a second sensing chip having the sensing function and a second non-sensing chip not having the sensing function, disposed on the third circuit board side by side along the third flow passage. The first and second sensing chips are respectively disposed on the second side and the first side of the semiconductor module.