Circuit board and semiconductor apparatus
The circuit board includes a plurality of bonding pads having a first bonding pad and a second bonding pad configured to supply a ground potential; a first ground wiring connected to the first bonding pad; a second ground wiring connected to the second bonding pad; and a first extension pad connecte...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | The circuit board includes a plurality of bonding pads having a first bonding pad and a second bonding pad configured to supply a ground potential; a first ground wiring connected to the first bonding pad; a second ground wiring connected to the second bonding pad; and a first extension pad connected to the first ground wiring and a second extension pad connected to the second ground wiring, the first extension pad and the and second extension pad being provided in a different area from an area in which the plurality of bonding pads is provided, the first extension pad and the and second extension pad being connectable through a wire. |
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