Programmable adhesive based upon Diels-Alder chemistry

Disclosed is an adhesive formulation that, when stimulated by a defeatable stimulation, reduces an adhesive bonding force of the adhesive formulation and defeats the adhesive formulation. The adhesive formulation having (i) programmable linkages made from Diels-Alder adducts and (ii) a concentration...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Stokes, Kristoffer K, Costanzo, Philip J
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	Disclosed is an adhesive formulation that, when stimulated by a defeatable stimulation, reduces an adhesive bonding force of the adhesive formulation and defeats the adhesive formulation. The adhesive formulation having (i) programmable linkages made from Diels-Alder adducts and (ii) a concentration of diene traps. The Diels-Alder adducts may be furan-maleimide, and the diene traps may be (i) latent alkenes and (ii) selected from functional groups that will create irreversible reations with furan. The adhesive formulation may be capable of being applied as a coating, and the adhesive formulation may be capable of being extruded. The adhesive formulation may have a bonding temperature between 75 and 120° C. And the defeatable stimulation could, for example, be a temperature above 130° C. The adhesive formulation also may contain several types of programmable linkages and diene traps.