Method and system for inspecting processing apparatus

Method and system for inspecting processing apparatus

A system configured to inspect a processing apparatus includes a temperature adjusting device configured to adjust a temperature of a component within a processing chamber of the processing apparatus; a light source configured to emit measurement light; multiple optical elements configured to output...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Nagai, Kenji, Sugita, Kippei
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
MEASURING ANGLES
MEASURING AREAS
MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS
MEASURING QUANTITY OF HEAT
MEASURING TEMPERATURE
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
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Beschreibung
Zusammenfassung:A system configured to inspect a processing apparatus includes a temperature adjusting device configured to adjust a temperature of a component within a processing chamber of the processing apparatus; a light source configured to emit measurement light; multiple optical elements configured to output the measurement light emitted from the light source to the component within the processing chamber of the processing apparatus as output light and configured to receive reflected light from the component during a temperature adjustment of the component by the temperature adjusting device; and a controller configured to measure temperatures of the component at measurement points respectively corresponding to the multiple optical elements based on the reflected light, and make a determination upon abnormality of the processing apparatus based on comparisons of the temperatures of the component at the respective measurement points.