Apparatuses and methods including patterns in scribe regions of semiconductor devices

Apparatuses including structures in scribe lines are described. An example apparatus includes: a first chip and a second chip; a scribe region between the first chip and the second chip; a crack guide region in the scribe region, the crack guide region including a dicing line along which the first c...

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Bibliographische Detailangaben
Hauptverfasser: Kawakita, Keizo, Bansal, Raj K, Sugioka, Shigeru, Tsai, Tsung Che
Format: Patent
Sprache:eng
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Zusammenfassung:Apparatuses including structures in scribe lines are described. An example apparatus includes: a first chip and a second chip; a scribe region between the first chip and the second chip; a crack guide region in the scribe region, the crack guide region including a dicing line along which the first chip and the second chip are to be divided; and a structure disposed in the crack guide region and extending along the dicing line.