Inkjet printhead assembly with wirebond protection

A printhead assembly includes: an ink manifold comprised of a first metal; printhead chips mounted on the ink manifold and receiving ink therefrom, each printhead chip having a plurality of bond pads; a PCB mounted on the ink manifold, the PCB having a plurality of contact pads; a plurality of wireb...

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Bibliographische Detailangaben
1. Verfasser:	Horrocks, Glenn
Format:	Patent
Sprache:	eng
Schlagworte:	CORRECTION OF TYPOGRAPHICAL ERRORS i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME LINING MACHINES PERFORMING OPERATIONS PRINTING SELECTIVE PRINTING MECHANISMS STAMPS TRANSPORTING TYPEWRITERS
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Beschreibung
Zusammenfassung:	A printhead assembly includes: an ink manifold comprised of a first metal; printhead chips mounted on the ink manifold and receiving ink therefrom, each printhead chip having a plurality of bond pads; a PCB mounted on the ink manifold, the PCB having a plurality of contact pads; a plurality of wirebonds interconnecting the bond pads and the contact pads, the wirebonds being comprised of a second metal; an encapsulant material encapsulating the wirebonds, the bond pads and the contact pads; and a voltage source. The ink manifold and the wirebonds are electrically connectable to the voltage source to provide cathodic protection of the wirebonds.