Microelectronic structures including bridges

Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate including a first metal layer and a second metal layer; a cavity in the substrate, wherein a portion of the first metal layer in the substrate and a portion of the second metal layer in the substrate are exposed in the cavity; and a bridge component in the cavity, the bridge component includes a first conductive contact at a first face and a second conductive contacts at an opposing second face, wherein the second face of the bridge component is between the first face of the bridge component and a bottom surface of the cavity in the substrate, and wherein the second conductive contact is electrically coupled to the portion of the first metal layer in the cavity.