Composite structure and semiconductor manufacturing apparatus including composite structure

Disclosed is to provide a composite structure used as a member for a semiconductor manufacturing apparatus with which low-particle generation can be improved, as well as a semiconductor manufacturing apparatus including the same. A composite structure including a base material and a structure that i...

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Bibliographische Detailangaben
Hauptverfasser: Ashizawa, Hiroaki, Takizawa, Ryoto
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Disclosed is to provide a composite structure used as a member for a semiconductor manufacturing apparatus with which low-particle generation can be improved, as well as a semiconductor manufacturing apparatus including the same. A composite structure including a base material and a structure that is provided on the base material and has a surface, in which the structure comprises Y3Al5O12 as a main component, and has an indentation hardness being larger than 8.5 GPa features excellent low-particle generation and is suitably used as a member for a semiconductor apparatus.