Imaging device for connection with a circuit element

A rewiring region 22 is provided in a region other than a pixel region 21 on a front face (pixel formation surface) FA of an imaging element 20. A mold part 30 is formed around the imaging element 20 other than on the front face FA. Rewiring layers 41b, 42b, and 43b that connect an external terminal...

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Bibliographische Detailangaben
Hauptverfasser:	Takaoka, Yuji, Momiuchi, Yuta
Format:	Patent
Sprache:	eng
Schlagworte:	ACCESSORIES THEREFOR APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USINGWAVES OTHER THAN OPTICAL WAVES APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FORPROJECTING OR VIEWING THEM BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHOTOGRAPHY PHYSICS PICTORIAL COMMUNICATION, e.g. TELEVISION PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A rewiring region 22 is provided in a region other than a pixel region 21 on a front face (pixel formation surface) FA of an imaging element 20. A mold part 30 is formed around the imaging element 20 other than on the front face FA. Rewiring layers 41b, 42b, and 43b that connect an external terminal and a pad 23 provided in the rewiring region 22 are formed via insulating layers 41a, 42a, and 43a on a side of the pixel formation surface of the imaging element 20 and the mold part 30. Therefore, connection to a substrate can be made possible even if the spacing between the pads is narrowed, a mounting surface of an imaging device 10 is also on the side of the pixel formation surface, and reduction in size and height can be achieved.