Dielectric and metallic nanowire bond layers

Dielectric and metallic nanowire bond layers

In some examples, an electronic device comprises a first component having a surface, a second component having a surface, and a bond layer positioned between the surfaces of the first and second components to couple the first and second components to each other. The bond layer includes a set of meta...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Koduri, Sreenivasan Kalyani, Muenster, Ralf Jakobskrueger, Summerfelt, Scott Robert, Cook, Benjamin Stassen
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:In some examples, an electronic device comprises a first component having a surface, a second component having a surface, and a bond layer positioned between the surfaces of the first and second components to couple the first and second components to each other. The bond layer includes a set of metallic nanowires and a dielectric portion. The dielectric portion comprises a polymer matrix and dielectric nanoparticles.