Chip bump interface compatible with different orientations and types of devices

Embodiments herein describe a multiple die system that includes an interposer that connects a first die to a second die. Each die has a bump interface structure that is connected to the other structure using traces in the interposer. However, the bump interface structures may have different orientations relative to each other, or one of the interface structures defines fewer signals than the other. Directly connecting the corresponding signals defined by the structures to each other may be impossible to do in the interposer, or make the interposer too costly. Instead, the embodiments here simplify routing in the interposer by connecting the signals in the bump interface structures in a way that simplifies the routing but jumbles the signals. The jumbled signals can then be corrected using reordering circuitry in the dies (e.g., in the link layer and physical layer).