Method of forming electronic chip package having a conductive layer between a chip and a support
The invention concerns a device comprising a support, an electrically-conductive layer covering the support, a semiconductor substrate on the conductive layer, and an insulating casing.
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| Hauptverfasser: | , |
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| Format: | Patent |
| Sprache: | eng |
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| Online-Zugang: | Volltext bestellen |
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| Zusammenfassung: | The invention concerns a device comprising a support, an electrically-conductive layer covering the support, a semiconductor substrate on the conductive layer, and an insulating casing. |
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