Disposing protective cover film and underfill layer over singulated integrated circuit dice for protection during integrated circuit processing

Singulated integrated circuit (IC) dice are provided. The singulated IC dice are positioned on dicing tape to provide open space between sides of adjacent singulated IC dice. An underfill layer and a protective cover film is disposed above the singulated IC dice and the open space between the sides of the adjacent singulated IC dice. The underfill layer and the protective cover film include one or more photodefinable materials. An exposure operation is performed to produce a pattern on the underfill layer and the protective cover film. Based on the pattern, the underfill layer and the protective cover film is removed at areas above the open space between the sides of the adjacent singulated IC dice to create portions of the underfill layer and portions of the protective cover film that are disposed above the singulated IC dice.