Substrate treatment apparatus and manufacturing method of semiconductor device

According to an embodiment, a substrate treatment apparatus includes a hair member including a noble metal, and a liquid chemical supply member to supply a liquid chemical. While a tip part of the hair member is contact with a predetermined surface of a metal, the liquid chemical is supplied onto th...

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Bibliographische Detailangaben
Hauptverfasser: Ito, Fuyuma, Yoshimizu, Yasuhito, Akeboshi, Yuya, Kitagawa, Hakuba
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:According to an embodiment, a substrate treatment apparatus includes a hair member including a noble metal, and a liquid chemical supply member to supply a liquid chemical. While a tip part of the hair member is contact with a predetermined surface of a metal, the liquid chemical is supplied onto the surface of the metal, and the metal is removed with etching.