Module with substrate recess for conductive-bonding component

In one general aspect, an apparatus can include a semiconductor component, a substrate including a recess, and a conductive-bonding component. The conductive-bonding component is disposed between the semiconductor component and the substrate. The conductive-bonding component has a first thickness be...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Lee, Keunhyuk, Liu, Yong, Chang, Jie, Ji, Sixin, Gu, Leo
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:In one general aspect, an apparatus can include a semiconductor component, a substrate including a recess, and a conductive-bonding component. The conductive-bonding component is disposed between the semiconductor component and the substrate. The conductive-bonding component has a first thickness between a bottom of the recess and a bottom surface of the semiconductor component greater than a second thickness between the top of the substrate and the bottom surface of the semiconductor component.