Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap

Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap

A substrate protrusion is described. The substrate protrusion includes a top portion that extends in a first direction toward a gap between the first die and the second die and in a second direction parallel to the gap between the first die and the second die. The substrate protrusion also includes...

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Bibliographische Detailangaben
Hauptverfasser: Mehta, Vipul, Cetegen, Edvin, Zhong, Shan, Gujjula, Sushrutha, Wei, Yuying, Ananthakrishnan, Nisha, Lin, Ziyin
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A substrate protrusion is described. The substrate protrusion includes a top portion that extends in a first direction toward a gap between the first die and the second die and in a second direction parallel to the gap between the first die and the second die. The substrate protrusion also includes a base portion that is coupled to a substrate that extends underneath the first die and the second die. An encapsulant is over the protrusion of the substrate, the encapsulant extending beneath the first die, and the encapsulant extending beneath the second die.