End effector measuring module and end effector monitoring apparatus using the same

Provided are an end effect measuring module and an end effect monitoring apparatus using the same. The end effect measuring module is installed at through holes formed between an Equipment Front End Module (EFEM) equipped with an end effector and a semiconductor processing apparatus for processing a wafer and measuring the position according to the movement path of a target passing the through holes. The measurement target is the end effector, and a sensing unit measures whether or not the end effector is shifted and changed in direction. A light receiving unit of the sensing unit outputs an electrical signal that is higher or lower than a reference value in response to shifting of the end effector, or outputs an electrical signal increasing or decreasing along a time axis in response to a directional change of the end effector.