Chip structure, packaging structure and manufacturing method for chip structure

The present disclosure provides a chip structure, a packaging structure and a manufacturing method for the chip structure. The chip structure includes at least one chip body, each of which includes at least one radio frequency front-end device; the chip structure further includes a redistribution la...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Duan, Liye, Liu, Zongmin, Huang, Jijing, Hou, Mengjun
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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