Chip structure, packaging structure and manufacturing method for chip structure

The present disclosure provides a chip structure, a packaging structure and a manufacturing method for the chip structure. The chip structure includes at least one chip body, each of which includes at least one radio frequency front-end device; the chip structure further includes a redistribution layer stacked on the chip body and at least one pin on the redistribution layer; each radio frequency front-end device corresponds to one pin, which is electrically connected to the radio frequency front-end device through an electrical connector extending through the redistribution layer; an extending direction of the radio frequency front-end device is consistent with an extending direction of the pin corresponding to the radio frequency front-end device; a surface of the pin distal to the redistribution layer is a first plane. In the present disclosure, with the first plane, the chip may be directly and electrically connected to a flexible circuit board.