Embedded multi-die interconnect bridge packages with lithographically formed bumps and methods of assembling same

Embedded multi-die interconnect bridge packages with lithographically formed bumps and methods of assembling same

An embedded multi-die interconnect bridge apparatus and method includes photolithographically formed interconnects coupled to laser-drilled interconnects. Several structures in the embedded multi-die interconnect bridge apparatus exhibit characteristic planarization during fabrication and assembly.

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Bibliographische Detailangaben
Hauptverfasser: Salama, Islam A, Alur, Amruthavalli Pallavi, May, Robert Alan, Sankman, Robert L, Boyapati, Sri Ranga Sai
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An embedded multi-die interconnect bridge apparatus and method includes photolithographically formed interconnects coupled to laser-drilled interconnects. Several structures in the embedded multi-die interconnect bridge apparatus exhibit characteristic planarization during fabrication and assembly.