Laser welding of square butt joints between copper substrates

A method of joining electrical connections together includes evaluating at least one weld joint between at least two substrates, determining a mismatch between the at least two substrates, and welding the at least two substrates together with a multi-step welding process. The multi-step welding proc...

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Bibliographische Detailangaben
Hauptverfasser: Wexler, Arnon, Ryan, Emily Ann, Hetrick, Elizabeth Therese
Format: Patent
Sprache:eng
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Zusammenfassung:A method of joining electrical connections together includes evaluating at least one weld joint between at least two substrates, determining a mismatch between the at least two substrates, and welding the at least two substrates together with a multi-step welding process. The multi-step welding process includes compensating for the mismatch between the at least two substrates by welding on both sides but not overlapping a joint line between the at least two substrate with a first welding step and increasing melt volume and penetration depth of a weld between the at least two substrates with a second welding step.