Polymer coating composition for metal substrate and use thereof

A polymer film for laminating onto a metal substrate (M), the polymer film including an adhesion layer (A) and a bulk layer (B), wherein the adhesion layer is intended for bonding to the metal substrate and includes 20 to 50 wt. % of a non-crystallisable copolyester, 50 to 80 wt. % of polybutylene t...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	Penning, Jan Paul, Pattiasina, Johannes Willem
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A polymer film for laminating onto a metal substrate (M), the polymer film including an adhesion layer (A) and a bulk layer (B), wherein the adhesion layer is intended for bonding to the metal substrate and includes 20 to 50 wt. % of a non-crystallisable copolyester, 50 to 80 wt. % of polybutylene terephthalate (PBT) and 0-10 wt. % of polymers and additives, and wherein the bulk layer consists of is at least 91 wt. % of PBT and at most 9% of other polymers and additives.