Method for producing an adhesive bond and support plate for producing an adhesive bond
The invention relates to a method for producing an adhesive bond between at least a first and a second, at least partially transparent planar component, in which the first component is laid onto a support plate, and an adhesive is applied to the first component at specified locations on the side of...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | The invention relates to a method for producing an adhesive bond between at least a first and a second, at least partially transparent planar component, in which the first component is laid onto a support plate, and an adhesive is applied to the first component at specified locations on the side of the first component facing away from the support plate, and the second component is laid onto the first component and is held parallel to the first component at a predefined distance, in such a way that the second component comes into contact with the adhesive on the first component. |
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