Electrical or electronic assembly and method for producing an electrical or electronic component

A method is provided for the production of an electrical or electronic component having a conductor element with two contact points and a plastic structure injection-molded thereon. A strip-type metal substrate, having multiple conductor element blanks and a carrier structure, is provided. Grooved depressions are produced on all peripheral surfaces of the blanks on a texturing section with one or two laser light sources. With a single laser light source the grooved depressions are produced on at least two primary peripheral surfaces which adjoin one another and form a common edge such that a multiplicity of the grooved depressions extends without interruption continuously into the primary peripheral surfaces. A conductor element blank is separated from the carrier structure. The resulting conductor element is encapsulated with plastic by injection molding on all peripheral surfaces within a section to be encapsulated. The plastic structure thereby formed extends into the grooved depressions.