Inverter device including a bootstrap circuit

To achieve high density integration of components while securing an insulation distance between a bootstrap capacitor and an intelligent power module. In a printed wiring board, a region where a capacitor is mounted is located in a region where an intelligent power module is mounted. Therefore, the...

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Bibliographische Detailangaben
Hauptverfasser: Fujiwara, Masahide, Itou, Taku, Hiraoka, Nobuyasu, Kotera, Keito, Kawashima, Reiji, Kouno, Masaki
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:To achieve high density integration of components while securing an insulation distance between a bootstrap capacitor and an intelligent power module. In a printed wiring board, a region where a capacitor is mounted is located in a region where an intelligent power module is mounted. Therefore, the capacitor mounted on the printed wiring board is placed between the printed wiring board and the intelligent power module.