Technologies for creating and distributing integration connectors in a cloud service brokerage system

Technologies for creating and distributing integration connectors in a cloud service brokerage system

Technologies for creating and distributing integration connectors in cloud service brokerage systems include a developer portal computing device communicatively coupled to a connector hub of a marketplace computing. The developer portal computing device is configured to receive information from a de...

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Bibliographische Detailangaben
Hauptverfasser: Khaerov, Alexander, Grebenshikov, Vladimir, Kuzkin, Maxim
Format: Patent
Sprache:eng
Schlagworte:
CALCULATING
COMPUTING
COUNTING
DATA PROCESSING SYSTEMS OR METHODS, SPECIALLY ADAPTED FORADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL, SUPERVISORYOR FORECASTING PURPOSES
ELECTRIC DIGITAL DATA PROCESSING
PHYSICS
SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE,COMMERCIAL, FINANCIAL, MANAGERIAL, SUPERVISORY OR FORECASTINGPURPOSES, NOT OTHERWISE PROVIDED FOR
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Zusammenfassung:Technologies for creating and distributing integration connectors in cloud service brokerage systems include a developer portal computing device communicatively coupled to a connector hub of a marketplace computing. The developer portal computing device is configured to receive information from a developer via a developer UI portal of a developer portal computing device. Such information includes connector descriptor information for a connector associated with a cloud service and one or more resource types of the connector. The developer portal computing device is further configured to build, via a connector builder of the developer portal computing device, the connector as a function of the connector descriptor information and the one or more resource types, generate a connector package for the built connector, and transmit the generated connector package to a connector hub of a cloud service marketplace computing device, wherein the connector package is usable to create one or more instances of the connector. Additional embodiments are described herein.