Sensor package and method

In an embodiment, a device includes: a sensor die having a first surface and a second surface opposite the first surface, the sensor die having an input/output region and a first sensing region at the first surface; an encapsulant at least laterally encapsulating the sensor die; a conductive via ext...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Tseng, Ying-Cheng, Yu, Chen-Hua, Huang, Yu-Chih, Kuo, Ting-Ting, Liu, Chiahung, Lai, Chi-Hui, Chiang, Tsung-Hsien, Tai, Chih-Hsuan, Wu, Ban-Li, Tsai, Hao-Yi, Liu, Chung-Shi
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!