Sensor package and method

Sensor package and method

In an embodiment, a device includes: a sensor die having a first surface and a second surface opposite the first surface, the sensor die having an input/output region and a first sensing region at the first surface; an encapsulant at least laterally encapsulating the sensor die; a conductive via ext...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Tseng, Ying-Cheng, Yu, Chen-Hua, Huang, Yu-Chih, Kuo, Ting-Ting, Liu, Chiahung, Lai, Chi-Hui, Chiang, Tsung-Hsien, Tai, Chih-Hsuan, Wu, Ban-Li, Tsai, Hao-Yi, Liu, Chung-Shi
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:In an embodiment, a device includes: a sensor die having a first surface and a second surface opposite the first surface, the sensor die having an input/output region and a first sensing region at the first surface; an encapsulant at least laterally encapsulating the sensor die; a conductive via extending through the encapsulant; and a front-side redistribution structure on the first surface of the sensor die, the front-side redistribution structure being connected to the conductive via and the sensor die, the front-side redistribution structure covering the input/output region of the sensor die, the front-side redistribution structure having a first opening exposing the first sensing region of the sensor die.