Sputtering apparatus and film forming method

A sputtering apparatus includes a first target and a second target that emit sputter particles, a substrate support configured to support a substrate, and a slit plate disposed between the first and the second targets and the substrate and having a slit unit through which the sputter particles pass....

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Bibliographische Detailangaben
Hauptverfasser: Hirasawa, Tatsuo, Iwashita, Hiroyuki, Abarra, Einstein Noel, Ishibashi, Shota, Toshima, Hiroyuki, Shinada, Masato
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A sputtering apparatus includes a first target and a second target that emit sputter particles, a substrate support configured to support a substrate, and a slit plate disposed between the first and the second targets and the substrate and having a slit unit through which the sputter particles pass. The slit unit includes a first slit to the first and the second target side and a second slit to the substrate side. The second slit has a first protrusion and a second protrusion protruding toward the center of the second slit. When the slit unit is viewed from the first target, the first protrusion is hidden. When the slit unit is viewed from the second target, the second protrusion is hidden.