Plate, plating apparatus, and method of manufacturing plate

Provided is a plate that is arranged between a substrate and an anode in a plating tank. This plate has a plurality of circular pores on each one of at least three reference circles that are concentric with each other and that are different from each other in diameter. The plurality of circular pore...

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Bibliographische Detailangaben
Hauptverfasser:	Shamoto, Mitsuhiro, Chang, Shao Hua, Shimoyama, Masashi
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	Provided is a plate that is arranged between a substrate and an anode in a plating tank. This plate has a plurality of circular pores on each one of at least three reference circles that are concentric with each other and that are different from each other in diameter. The plurality of circular pores include three circular pores that are arranged respectively on adjacent three of the at least three reference circles, and that have centers which are out of alignment with each other on an arbitrary radius on the plate.