Method and device for liquid spray soldering and the application method thereof

The disclosure relates to the field of spray welding, and involves a method and a device for liquid spray welding, as well as the application method thereof. The method for liquid spray welding specifically comprises the following steps: S1: Solder to be spray-soldered is melted under the protection...

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Bibliographische Detailangaben
Hauptverfasser:	Wang, Haiming, Huang, Yanling, Wang, Haiying, Zhou, Xuan, Tan, Zhengdong, Cai, Yunfeng, Li, Shengli, Cai, Shihong, Du, Junkuan
Format:	Patent
Sprache:	eng
Schlagworte:	APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ATOMISING APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR NOZZLES PERFORMING OPERATIONS SOLDERING OR UNSOLDERING SPRAYING APPARATUS SPRAYING OR ATOMISING IN GENERAL TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The disclosure relates to the field of spray welding, and involves a method and a device for liquid spray welding, as well as the application method thereof. The method for liquid spray welding specifically comprises the following steps: S1: Solder to be spray-soldered is melted under the protection of an inert gas; S2: Then, the melted solder is spray-soldered while using ultrasonic focusing. The device includes a solder conversion mechanism which consists of a container; the cavity in the container is used for placing the solder; a spraying hole is arranged at the bottom of the container to connect with the cavity, and a heating mechanism is mounted along the outer wall of the container; a device for driving the solder spraying is used to control the frequency of an ultrasonic generating mechanism.