Method and structure for FinFET comprising patterned oxide and dielectric layer under spacer features

A semiconductor device includes a fin projecting upwardly from a substrate; a gate stack engaging the fin; a gate spacer on a sidewall of the gate stack and in contact with the gate stack; and a dielectric layer on the sidewall of the gate stack and in contact with the gate stack, the dielectric lay...

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Bibliographische Detailangaben
Hauptverfasser: Chang, Che-Cheng, Lin, Jr-Jung, Chen, Shih-Hao, Lin, Chih-Han, Chang, Yung Jung, Lin, Mu-Tsang
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A semiconductor device includes a fin projecting upwardly from a substrate; a gate stack engaging the fin; a gate spacer on a sidewall of the gate stack and in contact with the gate stack; and a dielectric layer on the sidewall of the gate stack and in contact with the gate stack, the dielectric layer being vertically between the fin and the gate spacer, wherein the dielectric layer has a thickness small than the gate spacer.