Device for cutting structure and method for cutting structure

A cutting device capable of efficiently cutting an object with a simple configuration includes a grasp unit including a first grasper and a second grasper movable in an opening and closing directions to grasp the object, a cutting unit disposed side by side with the first and second graspers and mov...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Yamasaki, Takanori, Muraoka, Daisuke, Hosaka, Yoshinobu
Format:	Patent
Sprache:	eng
Schlagworte:	BUILDING BUILDING IMPLEMENTS OR OTHER BUILDING AIDS, OR THEIRUSE CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DREDGING FIXED CONSTRUCTIONS FORMS FOUNDATIONS HANDLING BUILDING MATERIALS ON THE SITE HYDRAULIC ENGINEERING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS REPAIRING, BREAKING-UP OR OTHER WORK ON EXISTINGBUILDINGS SCAFFOLDING SHUTTERING SOIL SHIFTING SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A cutting device capable of efficiently cutting an object with a simple configuration includes a grasp unit including a first grasper and a second grasper movable in an opening and closing directions to grasp the object, a cutting unit disposed side by side with the first and second graspers and moved in a cutting direction along the opening and closing directions to cut the object, and a position setter setting a cutting start position and a cutting end position based on respective positions of the first and second graspers that are grasping the object, respectively.