Thermally conductive resin composition and thermally conductive sheet using the same

A thermally conductive resin composition capable of maintaining high thermal conductivity and a thermally conductive sheet using the same, a thermally conductive resin composition contains an addition reaction type silicone resin, a thermally conductive filler, an alkoxysilane compound, and a carbod...

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Bibliographische Detailangaben
1. Verfasser:	Matsushima, Masayuki
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	A thermally conductive resin composition capable of maintaining high thermal conductivity and a thermally conductive sheet using the same, a thermally conductive resin composition contains an addition reaction type silicone resin, a thermally conductive filler, an alkoxysilane compound, and a carbodiimide compound in which a subcomponent is in an inactive state with respect to an alkoxysilane compound, and contains 55 to 85% by volume of the thermally conductive filler. A thermally conductive resin composition contains an addition reaction type silicone resin, an alkoxysilane compound, a thermally conductive filler, and a carbodiimide compound in which a subcomponent is in an inactive state with respect to the alkoxysilane compound, and exhibits thermal conductivity of 5 W/m*K or more after curing.