Robot gripper for moving wafer carriers and packing materials and method of operating the same

A robot gripper for moving wafer carriers and packing materials and a method of operating the same are provided. The robot gripper includes two opposing clamp assemblies. The two clamp assemblies are configured to move close to or away from each other. Each of the clamp assemblies includes a movable...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Chen, Chi-Wei, Lee, Chien-Fa, Hung, Fu-Cheng, Wu, Feng-Kuang, Chen, Chih-Hua
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A robot gripper for moving wafer carriers and packing materials and a method of operating the same are provided. The robot gripper includes two opposing clamp assemblies. The two clamp assemblies are configured to move close to or away from each other. Each of the clamp assemblies includes a movable support pin at a bottom of the clamp assembly.