Semiconductor chip module

A semiconductor chip module includes a PCB including first and second faces; a buffer on the first face; a first chip on the first face, and including a first connection terminal and a second connection terminal, a first signal being provided to the first connection terminal, and a second signal bei...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Cho, Jeong Hyeon, Seok, Jong-Hyun, Lee, Gyu Chae
Format: Patent
Sprache:eng
Schlagworte:
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