Polyimide precursor solution and method for producing porous polyimide film

A polyimide precursor solution includes: a polyimide precursor; a resin particle having 55% by weight or more of a structural unit derived from a styrene derivative; and a mixed solvent containing a first organic solvent (S1) and a second organic solvent (S2), wherein the polyimide precursor solutio...

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Bibliographische Detailangaben
Hauptverfasser:	Sasaki, Tomoya, Hirose, Hidekazu
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	A polyimide precursor solution includes: a polyimide precursor; a resin particle having 55% by weight or more of a structural unit derived from a styrene derivative; and a mixed solvent containing a first organic solvent (S1) and a second organic solvent (S2), wherein the polyimide precursor solution satisfies the following conditions (1) to (4),condition (1): a weight ratio (S1/S2) of the first organic solvent (S1) to the second organic solvent (S2) is from 50/50 to 90/10,condition (2): a HSP distance between the first organic solvent (S1) and the resin particle is 11 or more and less than 16,condition (3): a HSP distance between the second organic solvent (S2) and the resin particle is 16 or more, andcondition (4): a HSP distance between the mixed solvent and the polyimide precursor is 12 or less.