Medical device lead connection assembly

A method of forming a medical device lead connection element is described. The method includes positioning an end portion of a lead filar to overlap a lead end connection element such that the positioning creates mutual interference between the lead filar and the lead end connection element, and for...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Davies, Robert J, Humphrys, Seth M, Stone, Richard T, Janzig, Darren
Format: Patent
Sprache:eng
Schlagworte:
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