Medical device lead connection assembly

A method of forming a medical device lead connection element is described. The method includes positioning an end portion of a lead filar to overlap a lead end connection element such that the positioning creates mutual interference between the lead filar and the lead end connection element, and for...

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Bibliographische Detailangaben
Hauptverfasser:	Davies, Robert J, Humphrys, Seth M, Stone, Richard T, Janzig, Darren
Format:	Patent
Sprache:	eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTROTHERAPY HUMAN NECESSITIES HYGIENE MACHINE TOOLS MAGNETOTHERAPY MEDICAL OR VETERINARY SCIENCE METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS RADIATION THERAPY SOLDERING OR UNSOLDERING TRANSPORTING ULTRASOUND THERAPY WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A method of forming a medical device lead connection element is described. The method includes positioning an end portion of a lead filar to overlap a lead end connection element such that the positioning creates mutual interference between the lead filar and the lead end connection element, and forming an interference configuration. Then melting the end portion of the lead filar to form a weld joint and allowint the end portion of the lead filar to move towards the end connection element.