Semiconductor device package
The present disclosure provides a semiconductor device package. The semiconductor device package includes a substrate having a first surface and a second surface opposite to the first surface of the substrate. The substrate has a through opening extending between the first surface of the substrate a...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Zusammenfassung: | The present disclosure provides a semiconductor device package. The semiconductor device package includes a substrate having a first surface and a second surface opposite to the first surface of the substrate. The substrate has a through opening extending between the first surface of the substrate and the second surface of the substrate. The semiconductor device package also includes a conductive pad in the through opening and approximal to the second surface of the substrate. The conductive pad has a first surface and a second surface opposite to the first surface of the conductive pad. The semiconductor device package also includes a conductive pillar in contact with the first surface of the conductive pad. The second surface of the conductive pad protrudes from the second surface of the substrate. A method of manufacturing a semiconductor device package is also disclosed. |
|---|