Placement system for door of wafer pod

The application discloses a placement system for a door of a wafer pod, including a loadport. A docking interface is formed in the loadport, a placement mechanism is arranged on one side surface of the loadport, and includes a swing component, a follower component, and a docking plate. The swing component and the follower component are respectively connected to the docking plate, and the swing component can drive the docking plate to place the docking plate obliquely above the docking interface. By utilizing the space at the top of the loadport, the structural layout of the loadport is more reasonable; and the docking plate is placed nearly horizontally after the door is placed at a designated position, and provides a supporting force to the door, so that dependence on the vacuum suction is decreased, thereby avoiding the influences due to fluctuations of air pressure.